Our Services
Encapsulation of memory chips in DIL, QFP, SOIC, and SOP packages with precision.
Advanced wafer-level packaging and flip-chip solutions tailored for critical industries.
Advanced wafer-level packaging and flip-chip solutions tailored for critical industries.
Standard Encapsulation
Wafer-Level Packaging
We offer wafer-level packaging that ensures compact, reliable chip protection for aerospace and defense needs.
Flip-Chip Solutions
Our flip-chip process delivers superior electrical performance with quick turnaround times of 2 to 4 weeks.
Small Series Runs
We specialize in small to medium batches starting at 100 units, perfect for critical industrial projects.
Flip-Chip Solutions
Our processes meet ITAR qualifications and are progressing towards ISO 9001 and EN 9100 certifications.